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Annealsys Jipelic  MPT 600s  wafer ID wafer marking
March 1, 2012 Surface Science Delivers its 50th RTA system to a major
research University.

February 15, 2011  Surface Science Integration Relocates to new facility in
anticipation of future growth and expansion.

December 30, 2010 Surface Science Integration Opens second office in Dallas,
Texas to provide service and support of Midwest and East coast customers.


June 9, 2009  Surface Science Integration becomes an Affiliate Member of the
Nimet Nanoscale Research Facility at the University of Florida

As an affiliate member, SSI has access to the NRF facilities and will participate
in research with the Nanoscience Institute for Medical & Engineering
Technologies.

June 6, 2009  Surface Science Integration Partners with Cook & Associates
June 6, 2009 Surface Science Integration Partners with Cook & Associates to
sell and support SSI products on the US East Coast. Ron Cook and his team are
Industry leaders in providing semiconductor equipment and support.

August 10, 2008  Surface Science Integration Partners with A1A Vista Tech

Surface Science Integration has formally partnered with AIA Vista Tech to
provide Thermal Solutions to large panel production. A1A Vista Tech provides
custom production systems for high volume in the Solar Cell and Flat Panel
Industry.
See http://www.a1avistatech.com/

July 15, 2006  Surface Science Integration Partners with Labtec Sales
July 15, 2006 Surface Science Integration Partners with Labtec Sales, Inc, to
sell and support SSI products in Southern and Northern California. Labtec Sales
is an Industry leader in providing semiconductor equipment and support in the
State of California. Frank Lowry, Sales Director of Labtec, is an industry veteran
with many years of experience in providing solutions to the semiconductor
industry.

June 1, 2006  Surface Science Integration Announces Strategic Research with
The University of Florida

Surface Science Integration has partnered with The University of Florida
Department of Materials Science to develop and evaluate Advanced Rapid
Thermal Ozone processes for carbon removal and sub-atomic cleaning prior to
ohmic metalization of III-V compound semiconductors.